/*
 * (C) Copyright 2009
 * Stefano Babic DENX Software Engineering sbabic@denx.de.
 *
 * (C) Copyright 2010
 * Klaus Steinhammer TTECH Control Gmbh kst@tttech.com
 *
 * SPDX-License-Identifier:	GPL-2.0+
 *
 * Refer doc/README.imximage for more details about how-to configure
 * and create imximage boot image
 *
 * The syntax is taken as close as possible with the kwbimage
 */

/*
 * Boot Device : one of
 * spi, nand, onenand, sd
 */
BOOT_FROM	spi

/*
 * Device Configuration Data (DCD)
 *
 * Each entry must have the format:
 * Addr-type           Address        Value
 *
 * where:
 *	Addr-type register length (1,2 or 4 bytes)
 *	Address	  absolute address of the register
 *	value	  value to be stored in the register
 */

/*
 * #######################
 * ### Disable WDOG ###
 * #######################
 */
DATA 2 0x73f98000 0x30

/*
 * #######################
 * ### SET DDR Clk     ###
 * #######################
 */
/* CCM: CBMCR - ddr_clk_sel: axi_b (133MHz) */
DATA 4 0x73FD4018 0x000024C0

/* DOUBLE SPI CLK (13MHz->26 MHz Clock) */
DATA 4 0x73FD4038 0x2010241

/* IOMUXC_SW_PAD_CTL_PAD_CSPI1_MOSI HYS_ENABLE | DRV_MAX | SRE_FAST */
DATA 4 0x73fa8600 0x00000107
/* IOMUXC_SW_PAD_CTL_PAD_CSPI1_MISO HYS_ENABLE | DRV_MAX | SRE_FAST */
DATA 4 0x73fa8604 0x00000107
/* IOMUXC_SW_PAD_CTL_PAD_CSPI1_SS0 HYS_ENABLE | PKE_ENABLE | DRV_MAX | SRE_FAST */
DATA 4 0x73fa8608 0x00000187
/* IOMUXC_SW_PAD_CTL_PAD_CSPI1_SS1 HYS_ENABLE | PKE_ENABLE | DRV_MAX | SRE_FAST */
DATA 4 0x73fa860c 0x00000187
/* IOMUXC_SW_PAD_CTL_PAD_CSPI1_SCLK HYS_ENABLE | DRV_MAX | SRE_FAST */
DATA 4 0x73fa8614 0x00000107
/* IOMUXC_SW_PAD_CTL_PAD_DI1_PIN11 HYS_ENABLE | DRV_MAX | SRE_FAST (CSPI1_SS2) */
DATA 4 0x73fa86a8 0x00000187

/*
 * #######################
 * ### Settings IOMUXC ###
 * #######################
 */
/*
 * DDR IOMUX configuration
 * Control, Data, Address pads are in their default state: HIGH DS, FAST SR.
 * IOMUXC_SW_PAD_CTL_PAD_DRAM_SDCLK MAX DS
 */
DATA 4 0x73fa84b8 0x000000e7
/* PVTC MAX (at GPC, PGR reg) */
/* DATA 4 0x73FD8004 0x1fc00000 */

/* DQM0 DS high slew rate slow */
DATA 4 0x73fa84d4 0x000000e4
/* DQM1 DS high slew rate slow */
DATA 4 0x73fa84d8 0x000000e4
/* DQM2 DS high slew rate slow */
DATA 4 0x73fa84dc 0x000000e4
/* DQM3 DS high slew rate slow */
DATA 4 0x73fa84e0 0x000000e4

/* IOMUXC_SW_PAD_CTL_PAD_DRAM_SDQS0 DS high & SLEW slow */
DATA 4 0x73fa84bc 0x000000c4
/* IOMUXC_SW_PAD_CTL_PAD_DRAM_SDQS1 DS high & SLEW slow */
DATA 4 0x73fa84c0 0x000000c4
/* IOMUXC_SW_PAD_CTL_PAD_DRAM_SDQS2 DS high & SLEW slow */
DATA 4 0x73fa84c4 0x000000c4
/* IOMUXC_SW_PAD_CTL_PAD_DRAM_SDQS3 DS high & SLEW slow */
DATA 4 0x73fa84c8 0x000000c4

/* DRAM_DATA B0 */
DATA 4 0x73fa88a4 0x00000004
/* DRAM_DATA B1 */
DATA 4 0x73fa88ac 0x00000004
/* DRAM_DATA B2 */
DATA 4 0x73fa88b8 0x00000004
/* DRAM_DATA B3 */
DATA 4 0x73fa882c 0x00000004

/* DRAM_DATA B0 slew rate */
DATA 4 0x73fa8878 0x00000000
/* DRAM_DATA B1 slew rate */
DATA 4 0x73fa8880 0x00000000
/* DRAM_DATA B2 slew rate */
DATA 4 0x73fa888c 0x00000000
/* DRAM_DATA B3 slew rate */
DATA 4 0x73fa889c 0x00000000

/*
 * #######################
 * ### Configure SDRAM ###
 * #######################
 */

/* Configure CS0 */
/* ####################### */

/* ESDCTL0: Enable controller */
DATA 4 0x83fd9000 0x83220000

/* Init DRAM on CS0 /
/* ESDSCR: Precharge command */
DATA 4 0x83fd9014 0x04008008
/* ESDSCR: Refresh command */
DATA 4 0x83fd9014 0x00008010
/* ESDSCR: Refresh command */
DATA 4 0x83fd9014 0x00008010
/* ESDSCR: LMR with CAS=3 and BL=3 (Burst Length = 8) */
DATA 4 0x83fd9014 0x00338018
/* ESDSCR: EMR with half Drive strength (= medium strength @ i.MX51) */
DATA 4 0x83fd9014 0x0020801a
/* ESDSCR */
DATA 4 0x83fd9014 0x00008000

/* ESDSCR: EMR with full Drive strength */
/* DATA 4 0x83fd9014 0x0000801a */

/* ESDCTL0: 14 ROW, 10 COL, 32Bit, SREF=8 */
DATA 4 0x83fd9000 0xC3220000

/*
 * ESDCFG0: tRFC:22clks, tXSR:28clks, tXP:2clks, tWTR:2clk, tRP:3clks, tMRD:2clks
 *          tRAS:8clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:11clks
 * DATA 4 0x83fd9004 0xC33574AA
 */
/*
 * micron mDDR
 * ESDCFG0: tRFC:11clks, tXSR:19clks, tXP:1clks, tWTR:2clk, tRP:3clks, tMRD:2clks
 * tRAS:7clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:9clks
 * DATA 4 0x83FD9004 0x101564a8
 */
/*
 * hynix mDDR
 * ESDCFG0: tRFC:17clks, tXSR:21clks, tXP:3clks, tWTR:1clk, tRP:3clks, tMRD:2clks
 * tRAS:7clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:9clks
 */
DATA 4 0x83FD9004 0x704564a8

/* ESDMISC: AP=10, Bank interleaving on, MIF3 en, RALAT=2 */
DATA 4 0x83fd9010 0x000a1700

/* Configure CS1 */
/* ####################### */

/* ESDCTL1: Enable controller */
DATA 4 0x83fd9008 0x83220000

/* Init DRAM on CS1 */
/* ESDSCR: Precharge command */
DATA 4 0x83fd9014 0x0400800c
/* ESDSCR: Refresh command */
DATA 4 0x83fd9014 0x00008014
/* ESDSCR: Refresh command */
DATA 4 0x83fd9014 0x00008014
/* ESDSCR: LMR with CAS=3 and BL=3 (Burst Length = 8) */
DATA 4 0x83fd9014 0x0033801c
/* ESDSCR: EMR with half Drive strength (= medium strength @ i.MX51) */
DATA 4 0x83fd9014 0x0020801e
/* ESDSCR */
DATA 4 0x83fd9014 0x00008004

/* ESDCTL1: 14 ROW, 10 COL, 32Bit, SREF=8 */
DATA 4 0x83fd9008 0xC3220000
/*
 * ESDCFG1: tRFC:22clks, tXSR:28clks, tXP:2clks, tWTR:2clk, tRP:3clks, tMRD:2clks
 *          tRAS:8clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:11clks
 * DATA 4 0x83fd900c 0xC33574AA
 */
/*
 * micron mDDR
 * ESDCFG1: tRFC:11clks, tXSR:19clks, tXP:1clks, tWTR:2clk, tRP:3clks, tMRD:2clks
 * tRAS:7clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:9clks
 * DATA 4 0x83FD900C 0x101564a8
 */
/*
 * hynix mDDR
 * ESDCFG0: tRFC:17clks, tXSR:21clks, tXP:3clks, tWTR:1clk, tRP:3clks, tMRD:2clks
 * tRAS:7clks, tRRD:2clks, tWR:3clks, tRCD:3clks, tRC:9clks
 */
DATA 4 0x83FD900C 0x704564a8

/* ESDSCR (mDRAM configuration finished) */
DATA 4 0x83FD9014 0x00000004

/* ESDSCR - clear "configuration request" bit */
DATA 4 0x83fd9014 0x00000000