arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS)
device variants to create a secure u-boot_HS.img FIT blob that contains
U-Boot and DTB artifacts signed with a TI-specific process based on the
CONFIG_TI_SECURE_DEVICE config option and the externally-provided image
signing tool.
Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.
Signed-off-by: Daniel Allred <d-allred@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
diff --git a/configs/dra7xx_hs_evm_defconfig b/configs/dra7xx_hs_evm_defconfig
index 6933ab5..eb01f41 100644
--- a/configs/dra7xx_hs_evm_defconfig
+++ b/configs/dra7xx_hs_evm_defconfig
@@ -58,4 +58,5 @@
CONFIG_FIT=y
CONFIG_SPL_OF_LIBFDT=y
CONFIG_SPL_LOAD_FIT=y
+CONFIG_SPL_FIT_IMAGE_POST_PROCESS=y
CONFIG_OF_LIST="dra7-evm dra72-evm"