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Tom Rini53633a82024-02-29 12:33:36 -05001# SPDX-License-Identifier: (GPL-2.0)
2# Copyright 2020 Linaro Ltd.
3%YAML 1.2
4---
5$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml#
6$schema: http://devicetree.org/meta-schemas/base.yaml#
7
8title: Thermal zone
9
10maintainers:
11 - Daniel Lezcano <daniel.lezcano@linaro.org>
12
13description: |
14 Thermal management is achieved in devicetree by describing the sensor hardware
15 and the software abstraction of cooling devices and thermal zones required to
16 take appropriate action to mitigate thermal overloads.
17
18 The following node types are used to completely describe a thermal management
19 system in devicetree:
20 - thermal-sensor: device that measures temperature, has SoC-specific bindings
21 - cooling-device: device used to dissipate heat either passively or actively
22 - thermal-zones: a container of the following node types used to describe all
23 thermal data for the platform
24
25 This binding describes the thermal-zones.
26
27 The polling-delay properties of a thermal-zone are bound to the maximum dT/dt
28 (temperature derivative over time) in two situations for a thermal zone:
29 1. when passive cooling is activated (polling-delay-passive)
30 2. when the zone just needs to be monitored (polling-delay) or when
31 active cooling is activated.
32
33 The maximum dT/dt is highly bound to hardware power consumption and
34 dissipation capability. The delays should be chosen to account for said
35 max dT/dt, such that a device does not cross several trip boundaries
36 unexpectedly between polls. Choosing the right polling delays shall avoid
37 having the device in temperature ranges that may damage the silicon structures
38 and reduce silicon lifetime.
39
40properties:
41 $nodename:
42 const: thermal-zones
43 description:
44 A /thermal-zones node is required in order to use the thermal framework to
45 manage input from the various thermal zones in the system in order to
46 mitigate thermal overload conditions. It does not represent a real device
47 in the system, but acts as a container to link a thermal sensor device,
48 platform-data regarding temperature thresholds and the mitigation actions
49 to take when the temperature crosses those thresholds.
50
51patternProperties:
52 "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$":
53 type: object
54 description:
55 Each thermal zone node contains information about how frequently it
56 must be checked, the sensor responsible for reporting temperature for
57 this zone, one sub-node containing the various trip points for this
58 zone and one sub-node containing all the zone cooling-maps.
59
60 properties:
61 polling-delay:
62 $ref: /schemas/types.yaml#/definitions/uint32
63 description:
64 The maximum number of milliseconds to wait between polls when
65 checking this thermal zone. Setting this to 0 disables the polling
66 timers setup by the thermal framework and assumes that the thermal
67 sensors in this zone support interrupts.
68
69 polling-delay-passive:
70 $ref: /schemas/types.yaml#/definitions/uint32
71 description:
72 The maximum number of milliseconds to wait between polls when
73 checking this thermal zone while doing passive cooling. Setting
74 this to 0 disables the polling timers setup by the thermal
75 framework and assumes that the thermal sensors in this zone
76 support interrupts.
77
Tom Rini93743d22024-04-01 09:08:13 -040078 critical-action:
79 $ref: /schemas/types.yaml#/definitions/string
80 description: |
81 The action the OS should perform after the critical temperature is reached.
82 By default the system will shutdown as a safe action to prevent damage
83 to the hardware, if the property is not set.
84 The shutdown action should be always the default and preferred one.
85 Choose 'reboot' with care, as the hardware may be in thermal stress,
86 thus leading to infinite reboots that may cause damage to the hardware.
87 Make sure the firmware/bootloader will act as the last resort and take
88 over the thermal control.
89
90 enum:
91 - shutdown
92 - reboot
93
Tom Rini53633a82024-02-29 12:33:36 -050094 thermal-sensors:
95 $ref: /schemas/types.yaml#/definitions/phandle-array
96 maxItems: 1
97 description:
98 The thermal sensor phandle and sensor specifier used to monitor this
99 thermal zone.
100
101 coefficients:
102 $ref: /schemas/types.yaml#/definitions/uint32-array
103 description:
104 An array of integers containing the coefficients of a linear equation
105 that binds all the sensors listed in this thermal zone.
106
107 The linear equation used is as follows,
108 z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn
109 where c0, c1, .., cn are the coefficients.
110
111 Coefficients default to 1 in case this property is not specified. The
112 coefficients are ordered and are matched with sensors by means of the
113 sensor ID. Additional coefficients are interpreted as constant offset.
114
115 sustainable-power:
116 $ref: /schemas/types.yaml#/definitions/uint32
117 description:
118 An estimate of the sustainable power (in mW) that this thermal zone
119 can dissipate at the desired control temperature. For reference, the
120 sustainable power of a 4-inch phone is typically 2000mW, while on a
121 10-inch tablet is around 4500mW.
122
123 trips:
124 type: object
125 description:
126 This node describes a set of points in the temperature domain at
127 which the thermal framework needs to take action. The actions to
128 be taken are defined in another node called cooling-maps.
129
130 patternProperties:
131 "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$":
132 type: object
133
134 properties:
135 temperature:
136 $ref: /schemas/types.yaml#/definitions/int32
137 minimum: -273000
138 maximum: 200000
139 description:
140 An integer expressing the trip temperature in millicelsius.
141
142 hysteresis:
143 $ref: /schemas/types.yaml#/definitions/uint32
144 description:
145 An unsigned integer expressing the hysteresis delta with
146 respect to the trip temperature property above, also in
147 millicelsius. Any cooling action initiated by the framework is
148 maintained until the temperature falls below
149 (trip temperature - hysteresis). This potentially prevents a
150 situation where the trip gets constantly triggered soon after
151 cooling action is removed.
152
153 type:
154 $ref: /schemas/types.yaml#/definitions/string
155 enum:
156 - active # enable active cooling e.g. fans
157 - passive # enable passive cooling e.g. throttling cpu
158 - hot # send notification to driver
159 - critical # send notification to driver, trigger shutdown
160 description: |
161 There are four valid trip types: active, passive, hot,
162 critical.
163
164 The critical trip type is used to set the maximum
165 temperature threshold above which the HW becomes
166 unstable and underlying firmware might even trigger a
167 reboot. Hitting the critical threshold triggers a system
168 shutdown.
169
170 The hot trip type can be used to send a notification to
171 the thermal driver (if a .notify callback is registered).
172 The action to be taken is left to the driver.
173
174 The passive trip type can be used to slow down HW e.g. run
175 the CPU, GPU, bus at a lower frequency.
176
177 The active trip type can be used to control other HW to
178 help in cooling e.g. fans can be sped up or slowed down
179
180 required:
181 - temperature
182 - hysteresis
183 - type
184 additionalProperties: false
185
186 additionalProperties: false
187
188 cooling-maps:
189 type: object
190 additionalProperties: false
191 description:
192 This node describes the action to be taken when a thermal zone
193 crosses one of the temperature thresholds described in the trips
194 node. The action takes the form of a mapping relation between a
195 trip and the target cooling device state.
196
197 patternProperties:
198 "^map[-a-zA-Z0-9]*$":
199 type: object
200
201 properties:
202 trip:
203 $ref: /schemas/types.yaml#/definitions/phandle
204 description:
205 A phandle of a trip point node within this thermal zone.
206
207 cooling-device:
208 $ref: /schemas/types.yaml#/definitions/phandle-array
209 description:
210 A list of cooling device phandles along with the minimum
211 and maximum cooling state specifiers for each cooling
212 device. Using the THERMAL_NO_LIMIT (-1UL) constant in the
213 cooling-device phandle limit specifier lets the framework
214 use the minimum and maximum cooling state for that cooling
215 device automatically.
216
217 contribution:
218 $ref: /schemas/types.yaml#/definitions/uint32
219 description:
220 The cooling contribution to the thermal zone of the referred
221 cooling device at the referred trip point. The contribution is
222 a ratio of the sum of all cooling contributions within a
223 thermal zone.
224
225 required:
226 - trip
227 - cooling-device
228 additionalProperties: false
229
230 required:
231 - polling-delay
232 - polling-delay-passive
233 - thermal-sensors
234 - trips
235
236 additionalProperties: false
237
238additionalProperties: false
239
240examples:
241 - |
242 #include <dt-bindings/interrupt-controller/arm-gic.h>
243 #include <dt-bindings/thermal/thermal.h>
244
245 // Example 1: SDM845 TSENS
246 soc {
247 #address-cells = <2>;
248 #size-cells = <2>;
249
250 /* ... */
251
252 tsens0: thermal-sensor@c263000 {
253 compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
254 reg = <0 0x0c263000 0 0x1ff>, /* TM */
255 <0 0x0c222000 0 0x1ff>; /* SROT */
256 #qcom,sensors = <13>;
257 interrupts = <GIC_SPI 506 IRQ_TYPE_LEVEL_HIGH>,
258 <GIC_SPI 508 IRQ_TYPE_LEVEL_HIGH>;
259 interrupt-names = "uplow", "critical";
260 #thermal-sensor-cells = <1>;
261 };
262
263 tsens1: thermal-sensor@c265000 {
264 compatible = "qcom,sdm845-tsens", "qcom,tsens-v2";
265 reg = <0 0x0c265000 0 0x1ff>, /* TM */
266 <0 0x0c223000 0 0x1ff>; /* SROT */
267 #qcom,sensors = <8>;
268 interrupts = <GIC_SPI 507 IRQ_TYPE_LEVEL_HIGH>,
269 <GIC_SPI 509 IRQ_TYPE_LEVEL_HIGH>;
270 interrupt-names = "uplow", "critical";
271 #thermal-sensor-cells = <1>;
272 };
273 };
274
275 /* ... */
276
277 thermal-zones {
278 cpu0-thermal {
279 polling-delay-passive = <250>;
280 polling-delay = <1000>;
281
282 thermal-sensors = <&tsens0 1>;
283
284 trips {
285 cpu0_alert0: trip-point0 {
286 temperature = <90000>;
287 hysteresis = <2000>;
288 type = "passive";
289 };
290
291 cpu0_alert1: trip-point1 {
292 temperature = <95000>;
293 hysteresis = <2000>;
294 type = "passive";
295 };
296
297 cpu0_crit: cpu_crit {
298 temperature = <110000>;
299 hysteresis = <1000>;
300 type = "critical";
301 };
302 };
303
304 cooling-maps {
305 map0 {
306 trip = <&cpu0_alert0>;
307 /* Corresponds to 1400MHz in OPP table */
308 cooling-device = <&CPU0 3 3>, <&CPU1 3 3>,
309 <&CPU2 3 3>, <&CPU3 3 3>;
310 };
311
312 map1 {
313 trip = <&cpu0_alert1>;
314 /* Corresponds to 1000MHz in OPP table */
315 cooling-device = <&CPU0 5 5>, <&CPU1 5 5>,
316 <&CPU2 5 5>, <&CPU3 5 5>;
317 };
318 };
319 };
320
321 /* ... */
322
323 cluster0-thermal {
324 polling-delay-passive = <250>;
325 polling-delay = <1000>;
326
327 thermal-sensors = <&tsens0 5>;
328
329 trips {
330 cluster0_alert0: trip-point0 {
331 temperature = <90000>;
332 hysteresis = <2000>;
333 type = "hot";
334 };
335 cluster0_crit: cluster0_crit {
336 temperature = <110000>;
337 hysteresis = <2000>;
338 type = "critical";
339 };
340 };
341 };
342
343 /* ... */
344
345 gpu-top-thermal {
346 polling-delay-passive = <250>;
347 polling-delay = <1000>;
348
349 thermal-sensors = <&tsens0 11>;
350
351 trips {
352 gpu1_alert0: trip-point0 {
353 temperature = <90000>;
354 hysteresis = <2000>;
355 type = "hot";
356 };
357 };
358 };
359 };
360...